Fabrication of 3D structure with heterogeneous compositions using inkjet printing process

Do Kyeong Lee; Kyung Seop Sin; Cheol Shin; Jin Ho Kim; Kwang Taek Hwang; Ung Soo Kim; Sahn Nahm; Kyu Sung Han

doi:10.1016/j.mtcomm.2023.105753

Fabrication of 3D structure with heterogeneous compositions using inkjet printing process

Do Kyeong Lee, Kyung Seop Sin, Cheol Shin, Jin Ho Kim, Kwang Taek Hwang, Ung Soo Kim, Sahn Nahm, Kyu Sung Han

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

Inkjet based 3D printing technology discharges fine ink droplets from multiple printer heads to perform patterning and depositing in the target locations. The inkjet 3D printing can be differentiated from other 3D printing processes. It can print multiple materials simultaneously by using multiple printer heads, thus it is appropriate to create heterogeneous complex structure such as electronic devices. This study demonstrated the inkjet 3D printing to manufacture multi-layer composite structures using photocurable SiO₂ ink and intense pulsed light (IPL) sinterable conductive Cu ink. The rheology and deposition behavior of each ink were investigated so that it could be applied for inkjet 3D printing. The various shape of 3D structures which are consist of insulative and conductive layers were fabricated to study the applicability of inkjet 3D printing in the electronics.

Original language	English
Article number	105753
Journal	Materials Today Communications
Volume	35
DOIs	https://doi.org/10.1016/j.mtcomm.2023.105753
Publication status	Published - 2023 Jun

Bibliographical note

Funding Information:
This work was supported by World Class 300 R&D Program ( S2641323 ) jointly funded by the Ministry of Trade, Industry and Energy , and the Ministry of SMEs and Startups .

Publisher Copyright:
© 2023 The Authors

Keywords

IPL sinterable Cu ink
Inkjet 3D printing
Intense pulsed light sintering
Photocurable HDDA-SiO composite ink

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Materials Chemistry

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10.1016/j.mtcomm.2023.105753

Cite this

@article{cc34fac905ff452682260479b548b929,

title = "Fabrication of 3D structure with heterogeneous compositions using inkjet printing process",

abstract = "Inkjet based 3D printing technology discharges fine ink droplets from multiple printer heads to perform patterning and depositing in the target locations. The inkjet 3D printing can be differentiated from other 3D printing processes. It can print multiple materials simultaneously by using multiple printer heads, thus it is appropriate to create heterogeneous complex structure such as electronic devices. This study demonstrated the inkjet 3D printing to manufacture multi-layer composite structures using photocurable SiO2 ink and intense pulsed light (IPL) sinterable conductive Cu ink. The rheology and deposition behavior of each ink were investigated so that it could be applied for inkjet 3D printing. The various shape of 3D structures which are consist of insulative and conductive layers were fabricated to study the applicability of inkjet 3D printing in the electronics.",

keywords = "IPL sinterable Cu ink, Inkjet 3D printing, Intense pulsed light sintering, Photocurable HDDA-SiO composite ink",

author = "Lee, {Do Kyeong} and Sin, {Kyung Seop} and Cheol Shin and Kim, {Jin Ho} and Hwang, {Kwang Taek} and Kim, {Ung Soo} and Sahn Nahm and Han, {Kyu Sung}",

note = "Funding Information: This work was supported by World Class 300 R&D Program ( S2641323 ) jointly funded by the Ministry of Trade, Industry and Energy , and the Ministry of SMEs and Startups . Publisher Copyright: {\textcopyright} 2023 The Authors",

year = "2023",

month = jun,

doi = "10.1016/j.mtcomm.2023.105753",

language = "English",

volume = "35",

journal = "Materials Today Communications",

issn = "2352-4928",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Fabrication of 3D structure with heterogeneous compositions using inkjet printing process

AU - Lee, Do Kyeong

AU - Sin, Kyung Seop

AU - Shin, Cheol

AU - Kim, Jin Ho

AU - Hwang, Kwang Taek

AU - Kim, Ung Soo

AU - Nahm, Sahn

AU - Han, Kyu Sung

N1 - Funding Information: This work was supported by World Class 300 R&D Program ( S2641323 ) jointly funded by the Ministry of Trade, Industry and Energy , and the Ministry of SMEs and Startups . Publisher Copyright: © 2023 The Authors

PY - 2023/6

Y1 - 2023/6

N2 - Inkjet based 3D printing technology discharges fine ink droplets from multiple printer heads to perform patterning and depositing in the target locations. The inkjet 3D printing can be differentiated from other 3D printing processes. It can print multiple materials simultaneously by using multiple printer heads, thus it is appropriate to create heterogeneous complex structure such as electronic devices. This study demonstrated the inkjet 3D printing to manufacture multi-layer composite structures using photocurable SiO2 ink and intense pulsed light (IPL) sinterable conductive Cu ink. The rheology and deposition behavior of each ink were investigated so that it could be applied for inkjet 3D printing. The various shape of 3D structures which are consist of insulative and conductive layers were fabricated to study the applicability of inkjet 3D printing in the electronics.

AB - Inkjet based 3D printing technology discharges fine ink droplets from multiple printer heads to perform patterning and depositing in the target locations. The inkjet 3D printing can be differentiated from other 3D printing processes. It can print multiple materials simultaneously by using multiple printer heads, thus it is appropriate to create heterogeneous complex structure such as electronic devices. This study demonstrated the inkjet 3D printing to manufacture multi-layer composite structures using photocurable SiO2 ink and intense pulsed light (IPL) sinterable conductive Cu ink. The rheology and deposition behavior of each ink were investigated so that it could be applied for inkjet 3D printing. The various shape of 3D structures which are consist of insulative and conductive layers were fabricated to study the applicability of inkjet 3D printing in the electronics.

KW - IPL sinterable Cu ink

KW - Inkjet 3D printing

KW - Intense pulsed light sintering

KW - Photocurable HDDA-SiO composite ink

UR - http://www.scopus.com/inward/record.url?scp=85149440346&partnerID=8YFLogxK

U2 - 10.1016/j.mtcomm.2023.105753

DO - 10.1016/j.mtcomm.2023.105753

M3 - Article

AN - SCOPUS:85149440346

SN - 2352-4928

VL - 35

JO - Materials Today Communications

JF - Materials Today Communications

M1 - 105753

ER -

Fabrication of 3D structure with heterogeneous compositions using inkjet printing process

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Bibliographical note

Keywords

ASJC Scopus subject areas

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