Fabrication of a polyurethane acrylate/polyimide-based polymer mold for a hot embossing process

Kang In Kim, Kang Soo Han, Ki Yeon Yang, Hyeong Seok Kim, Heon Lee

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


A high-thermal-resistance polymer-based flexible imprint mold was developed to be used in a hot embossing process. This mold was readily replicated in a UV curing imprint process and can be used as a mold for hot embossing and thermally curing imprint processes. The nano-sized pattern of this mold was not degraded by soaking at 350 °C for 10 min and the pattern fidelity was maintained after 10 separate cyclic heating tests between 0 °C and 350 °C. The substrate of this flexible mold was PI film, and a UV-cured polyurethane acrylate (PUA) layer was used to form the nano-scale patterns. The durability of this polymeric mold was tested by repetitive hot embossing processes. Nano-scale patterns of the mold were readily transferred to a PMMA layer coated onto a Si substrate by hot embossing lithography at 180 °C. After 10 cycles of hot embossing processes, no damage or degradation was observed in the flexible polymer mold. Using this polymer mold, patterns as small as 50 nm were successfully transferred to a Si substrate. Due to the flexibility of the polymer mold, nano-scale patterns were successfully transferred to a non-flat acryl substrate by hot embossing lithography.

Original languageEnglish
Pages (from-to)3417-3420
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Issue number4
Publication statusPublished - 2012


  • Flexible mold
  • Hot embossing
  • Nano-imprint lithography
  • Non-flat substrate
  • PI
  • PUA

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • Biomedical Engineering
  • General Materials Science
  • Condensed Matter Physics


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