TY - GEN
T1 - Fabrication of multilayer passive electric components using inkjet printing and low temperature laser processing on polymer
AU - Ko, Seung Hwan
AU - Chung, Jaewon
AU - Pan, Heng
AU - Grigoropoulos, Costas P.
AU - Poulikakos, Dimos
PY - 2006
Y1 - 2006
N2 - The low temperature fabrication of passive electrical components (conductor, capacitor) on the flexible polymer substrate is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in Alpha-Terpineol solvent and PVP in PGMEA solvent to fabricate passive electrical components on flexible polymer substrate. Short pulsed laser ablation enabled finer electrical components to overcome limitation of inkjet process. Continuous Argon ion laser was irradiated locally to evaporate carrier solvent as well as to sinter gold nano-particles. In addition, a self alignment technique for PVP layer was demonstrated taking advantage of the deliberate modification of surface wetting characteristics. Finally, a new selective ablation of multilayered gold nanoparticle film was demonstrated using the ablation threshold difference for sintered and non sintered gold nanoparticles.
AB - The low temperature fabrication of passive electrical components (conductor, capacitor) on the flexible polymer substrate is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in Alpha-Terpineol solvent and PVP in PGMEA solvent to fabricate passive electrical components on flexible polymer substrate. Short pulsed laser ablation enabled finer electrical components to overcome limitation of inkjet process. Continuous Argon ion laser was irradiated locally to evaporate carrier solvent as well as to sinter gold nano-particles. In addition, a self alignment technique for PVP layer was demonstrated taking advantage of the deliberate modification of surface wetting characteristics. Finally, a new selective ablation of multilayered gold nanoparticle film was demonstrated using the ablation threshold difference for sintered and non sintered gold nanoparticles.
KW - Flexible electronics
KW - Inkjet printing
KW - Laser ablation and sintering
KW - NALSA (nanomaterial assisted laser sintering and ablation)
KW - Nanoparticle
KW - SPLA-DAT (selective pulsed laser ablation by different ablation threshold) multilayer processing
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U2 - 10.1117/12.647872
DO - 10.1117/12.647872
M3 - Conference contribution
AN - SCOPUS:33646598108
SN - 0819461482
SN - 9780819461483
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Photon Processing in Microelectronics and Photonics V
T2 - Photon Processing in Microelectronics and Photonics V
Y2 - 23 January 2006 through 26 January 2006
ER -