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Fabrication of silver stabilization layer of coated conductor using organic silver complexes
J. B. Lee
, S. J. Park
, S. S. Kim
, S. H. Moon
,
H. G. Lee
, J. H. Kim
, S. X. Dou
, G. W. Hong
Research output
:
Contribution to journal
›
Article
›
peer-review
4
Citations (Scopus)
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Keyphrases
Coated Conductor
100%
Dip Coating
100%
Stabilizer Layer
100%
Organic Silver Complexes
100%
Silver Layer
50%
Electroplating
25%
Sputtering Method
25%
Adhesion Properties
25%
Heat Treatment
25%
In Situ
25%
Silver(I) Complexes
25%
Crystalline Properties
25%
Oxygen Atmosphere
25%
Surface Coverage
25%
Industrial Production
25%
Coating Treatment
25%
Post-heat Treatment
25%
HOX Transcript Antisense RNA (HOTAIR)
25%
Mechanical Adhesion
25%
Interface Resistance
25%
Copper Layer
25%
Material Science
Conductor
100%
Silver
100%
Heat Treatment
22%
Film
11%
Electrical Resistivity
11%
Electroplating
11%
Crystallographic Property
11%
Surface (Surface Science)
11%