Fabrication of submicron metallic grids with interference and phase-mask holography

Joong Mok Park, Tae Geun Kim, Kristen Constant, Kai Ming Ho

    Research output: Contribution to journalArticlepeer-review

    8 Citations (Scopus)

    Abstract

    Complex, submicron Cu metallic mesh nanostructures are made by electrochemical deposition using polymer templates made from photoresist. The polymer templates are fabricated with photoresist using two-beam interference holography and phase mask holography with three diffracted beams. Freestanding metallic mesh structures are made in two separate electrodepositions with perpendicular photoresist grating templates. Cu mesh square nanostructures having large (52.6) open areas are also made by single electrodeposition with a photoresist template made with a phase mask. These structures have potential as electrodes in photonic devices.

    Original languageEnglish
    Article number013011
    JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
    Volume10
    Issue number1
    DOIs
    Publication statusPublished - 2011

    Bibliographical note

    Funding Information:
    This work is supported by the Division of Materials Sciences and Engineering, Basic Energy Sciences, U.S. Department of Energy. The Ames Laboratory is operated by Iowa State University for the Office of Science, U.S. Department of Energy under Contract No. DE-AC0207-CH11358. This work also was supported by a Korea Research Foundation grant funded by the Korean Government (MOEHRD) (Grant No. KRF-2008-D00074) and partly supported by a Korea Science and Engineering Foundation (KOSEF) grant funded by the Korea government (MOST) under Project No. F012007-00011760-0.

    Keywords

    • complex nanostructures
    • fabrication and characterization nanoscale materials
    • holographic interferometry
    • methods of micro- and nanofabrication
    • photonic bandgap materials

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Mechanical Engineering
    • Electrical and Electronic Engineering

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