TY - JOUR
T1 - Facile Nanocasting of Dielectric Metasurfaces with Sub-100 nm Resolution
AU - Kim, Kwan
AU - Yoon, Gwanho
AU - Baek, Seungho
AU - Rho, Junsuk
AU - Lee, Heon
N1 - Funding Information:
This work is financially supported from the National Research Foundation grants (NRF-2018M3D1A1058998, NRF-2019R1A2C3003129, CAMM-2019M3A6B3030637, NRF-2015R1A5A1037668) funded by the Ministry of Science and ICT (MSIT) and the Technology Innovation Program (20000887, N0002310) funded by the Ministry of Trade, Industry & Energy (MOTIE) of the Korean government.
PY - 2019/7/24
Y1 - 2019/7/24
N2 - This work presents a facile nanocasting technique to fabricate dielectric metasurfaces at low cost and high throughput. A flexible polymer mold is replicated from a master mold, and then the polymer mold is used to shape particle-embedded UV-curable polymer resin. The polymer mold is compatible with flexible and curved substrates. A hard-polydimethylsiloxane improves mechanical stability of the polymer mold providing sub-100 nm patterning resolution. The patterned resin itself can work as a metasurface without secondary operations because dielectric particles sufficiently increase the refractive index of the resin. The absence of the secondary operations allows our method to have higher productivity and cost competitiveness than those of typical nanoimprint lithography. Experimental demonstration verifies the feasibility of our method, and the replicated metasurface exhibits a conversion efficiency of 46% in the visible, which is comparable to metasurfaces based on low-loss dielectrics. Given that conventional dielectric metasurfaces have been fabricated by electron beam lithography at formidable cost due to low throughput, our method will be a promising nanofabrication platform and thereby facilitate commercialization of dielectric metasurfaces.
AB - This work presents a facile nanocasting technique to fabricate dielectric metasurfaces at low cost and high throughput. A flexible polymer mold is replicated from a master mold, and then the polymer mold is used to shape particle-embedded UV-curable polymer resin. The polymer mold is compatible with flexible and curved substrates. A hard-polydimethylsiloxane improves mechanical stability of the polymer mold providing sub-100 nm patterning resolution. The patterned resin itself can work as a metasurface without secondary operations because dielectric particles sufficiently increase the refractive index of the resin. The absence of the secondary operations allows our method to have higher productivity and cost competitiveness than those of typical nanoimprint lithography. Experimental demonstration verifies the feasibility of our method, and the replicated metasurface exhibits a conversion efficiency of 46% in the visible, which is comparable to metasurfaces based on low-loss dielectrics. Given that conventional dielectric metasurfaces have been fabricated by electron beam lithography at formidable cost due to low throughput, our method will be a promising nanofabrication platform and thereby facilitate commercialization of dielectric metasurfaces.
KW - UV curing
KW - hard-polydimethylsiloxane
KW - low cost
KW - nanofabrication
KW - nanoimprint lithography
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U2 - 10.1021/acsami.9b07774
DO - 10.1021/acsami.9b07774
M3 - Article
C2 - 31262166
AN - SCOPUS:85070485270
SN - 1944-8244
VL - 11
SP - 26109
EP - 26115
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 29
ER -