Fingerprint
Dive into the research topics of 'Fast concurrent growth of Ni 3Sn 4 and voids during solid-state reaction between Sn-rich solder and Ni substrates'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Fast concurrent growth of Ni 3Sn 4 and voids during solid-state reaction between Sn-rich solder and Ni substrates
Bo Mook Chung, Jaeho Choi, Joo Youl Huh
Research output: Contribution to journal › Article › peer-review
7
Citations
(Scopus)