Feature-learning-based printed circuit board inspection via speeded-up robust features and random forest

Eun Hye Yuk, Seung Hwan Park, Cheong Sool Park, Jun Geol Baek

    Research output: Contribution to journalArticlepeer-review

    53 Citations (Scopus)

    Abstract

    With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB), which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF), then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE) map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

    Original languageEnglish
    Article number932
    JournalApplied Sciences (Switzerland)
    Volume8
    Issue number6
    DOIs
    Publication statusPublished - 2018 Jun 5

    Bibliographical note

    Funding Information:
    funded by the Korea government (MSIP)(NRF-2016R1A2B4013678). This work was also supported by BK21 Plus (Big Data in Manufacturing and Logistics Systems, Korea University). Acknowledgments: This work was supported by the National Research Foundation of Korea (NRF) grant funded Conflicts of Interest: The authors declare no conflict of interest. by the Korea government (MSIP) (NRF-2016R1A2B4013678). This work was also supported by BK21 Plus (Big Data in Manufacturing and Logistics Systems, Korea University). References Conflicts of Interest: The authors declare no conflict of interest. 1. 2014Malg, e3,, 1P.S..; NadAvailableaf,R.S.onlineA su:rvhttps:ey:A//www.ijert.org/browse/volume-3-2014/januarutomatedvisual PCB inspectionalgorithm.Int. J. Eng. Res. Technol.y-2014-edition?start=20

    Publisher Copyright:
    © 2018 by the authors.

    Keywords

    • Fault pattern learning
    • Feature extraction
    • Image inspection
    • Non-referential method
    • Weighted kernel density estimation (WKDE)

    ASJC Scopus subject areas

    • General Materials Science
    • Instrumentation
    • General Engineering
    • Process Chemistry and Technology
    • Computer Science Applications
    • Fluid Flow and Transfer Processes

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