Flexible tactile sensor fabricated using polymer membrane

Woo Sung Cho; Kunnyun Kim; Kang Ryeol Lee; Yong Kook Kim; Dae Sung Lee; Won Hyo Kim; Nam Kyu Cho; Kwang Bum Park; Hyo Derk Park; Jung Ho Park; Byeong Kwon Ju

doi:10.1109/ICSENS.2007.355572

Flexible tactile sensor fabricated using polymer membrane

Woo Sung Cho, Kunnyun Kim, Kang Ryeol Lee, Yong Kook Kim, Dae Sung Lee, Won Hyo Kim, Nam Kyu Cho, Kwang Bum Park, Hyo Derk Park, Jung Ho Park, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.

Original language	English
Title of host publication	2006 5th IEEE Conference on Sensors
Pages	730-733
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2007.355572
Publication status	Published - 2006
Event	2006 5th IEEE Conference on Sensors - Daegu, Korea, Republic of Duration: 2006 Oct 22 → 2006 Oct 25

Publication series

Name	Proceedings of IEEE Sensors

Other

Other	2006 5th IEEE Conference on Sensors
Country/Territory	Korea, Republic of
City	Daegu
Period	06/10/22 → 06/10/25

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICSENS.2007.355572

Cite this

Cho, WS, Kim, K, Lee, KR, Kim, YK, Lee, DS, Kim, WH, Cho, NK, Park, KB, Park, HD, Park, JH & Ju, BK 2006, Flexible tactile sensor fabricated using polymer membrane. in 2006 5th IEEE Conference on Sensors., 4178724, Proceedings of IEEE Sensors, pp. 730-733, 2006 5th IEEE Conference on Sensors, Daegu, Korea, Republic of, 06/10/22. https://doi.org/10.1109/ICSENS.2007.355572

@inproceedings{7df5848d881346c49ce4a9b0e12da07e,

title = "Flexible tactile sensor fabricated using polymer membrane",

abstract = "We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.",

author = "Cho, {Woo Sung} and Kunnyun Kim and Lee, {Kang Ryeol} and Kim, {Yong Kook} and Lee, {Dae Sung} and Kim, {Won Hyo} and Cho, {Nam Kyu} and Park, {Kwang Bum} and Park, {Hyo Derk} and Park, {Jung Ho} and Ju, {Byeong Kwon}",

year = "2006",

doi = "10.1109/ICSENS.2007.355572",

language = "English",

isbn = "1424403766",

series = "Proceedings of IEEE Sensors",

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booktitle = "2006 5th IEEE Conference on Sensors",

note = "2006 5th IEEE Conference on Sensors ; Conference date: 22-10-2006 Through 25-10-2006",

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AU - Cho, Woo Sung

AU - Kim, Kunnyun

AU - Lee, Kang Ryeol

AU - Kim, Yong Kook

AU - Lee, Dae Sung

AU - Kim, Won Hyo

AU - Cho, Nam Kyu

AU - Park, Kwang Bum

AU - Park, Hyo Derk

AU - Park, Jung Ho

AU - Ju, Byeong Kwon

PY - 2006

Y1 - 2006

N2 - We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.

AB - We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.

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U2 - 10.1109/ICSENS.2007.355572

DO - 10.1109/ICSENS.2007.355572

M3 - Conference contribution

AN - SCOPUS:43249106761

SN - 1424403766

SN - 9781424403769

T3 - Proceedings of IEEE Sensors

SP - 730

EP - 733

BT - 2006 5th IEEE Conference on Sensors

T2 - 2006 5th IEEE Conference on Sensors

Y2 - 22 October 2006 through 25 October 2006

ER -

Flexible tactile sensor fabricated using polymer membrane

Abstract

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