Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

  • Doosoo Kim*
  • , Jong Hyeon Chang
  • , Jungil Park
  • , James Jungho Pak
  • *Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    123 Citations (Scopus)

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    Keyphrases

    Engineering

    Material Science