Skip to main navigation
Skip to search
Skip to main content
Korea University Pure Home
Home
Profiles
Research units
Equipment
Research output
Press/Media
Search by expertise, name or affiliation
Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)
Shin Kun Ryi
*
, Jong Soo Park
, Sung Hyun Kim
, Dong Won Kim
, Kyu Il Cho
*
Corresponding author for this work
Research output
:
Contribution to journal
›
Article
›
peer-review
35
Citations (Scopus)
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Cu-Ni
100%
PdCu
100%
Alloy Membrane
100%
Ternary Alloys
100%
Porous Nickel Support
100%
Pore Size
40%
Polishing Process
40%
Surface Roughness
20%
Surface Pores
20%
Nickel Powder
20%
Large Particle Size
20%
Gas Permeation
20%
Alloy Films
20%
Alumina Powder
20%
Gas Permeation Test
20%
Hydrogen Permeation
20%
Reflow
20%
Wet Polishing
20%
Upward Diffusion
20%
Support Resistance
20%
Sandpaper
20%
Polishing Treatment
20%
Material Science
Pore Size
100%
Ternary Alloy
100%
Film
50%
Surface Roughness
50%
Aluminum Oxide
50%
Polishing
50%
Surface (Surface Science)
50%
Chemical Engineering
Film
100%