Abstract
A robust and efficient strategy for preparing a substrate for highly flexible and patchable electronics was developed via a photo-crosslinking LbL spin-coating process that allows various thicknesses to be achieved without any rinsing or intermediate purification steps.
| Original language | English |
|---|---|
| Pages (from-to) | 4488-4490 |
| Number of pages | 3 |
| Journal | Journal of Materials Chemistry |
| Volume | 19 |
| Issue number | 26 |
| DOIs | |
| Publication status | Published - 2009 |
ASJC Scopus subject areas
- General Chemistry
- Materials Chemistry