Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim; Hoi Ju Chung; Sung Ho Yoon; Sung Woo Hwang; Jinwoo Park; Soo Won Kim; Joongho Choi; Doyeol Ahn

doi:10.1109/6144.833059

Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim, Hoi Ju Chung, Sung Ho Yoon, Sung Woo Hwang, Jinwoo Park, Soo Won Kim, Joongho Choi, Doyeol Ahn

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

Original language	English
Pages (from-to)	183-189
Number of pages	7
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	1
DOIs	https://doi.org/10.1109/6144.833059
Publication status	Published - 2000

Bibliographical note

Funding Information:
Manuscript received November 1, 1999; revised December 22, 1999. This paper was recommended for publication by Associate Editor A. Deutsch upon evaluation of the reviewers’ comments. This work was supported by the Korea Research Foundation. K. H. Kim, S. W. Hwang, J.-W. Park, and S.-W. Kim are with the Department of Electronics Engineering, Korea University, Seoul 136-701, Korea. H. J. Chung and S. H. Yoon are with the Samsung Electronics Corporation, Kyungkido 449-711, Korea. J. Choi and D. Ahn are with the Department of Electronics Engineering, University of Seoul, Seoul 130-020, Korea. Publisher Item Identifier S 1521-3331(00)02688-X.

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/6144.833059

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abstract = "We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.",

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AU - Kim, Ki Hyuk

AU - Chung, Hoi Ju

AU - Yoon, Sung Ho

AU - Hwang, Sung Woo

AU - Park, Jinwoo

AU - Kim, Soo Won

AU - Choi, Joongho

AU - Ahn, Doyeol

N1 - Funding Information: Manuscript received November 1, 1999; revised December 22, 1999. This paper was recommended for publication by Associate Editor A. Deutsch upon evaluation of the reviewers’ comments. This work was supported by the Korea Research Foundation. K. H. Kim, S. W. Hwang, J.-W. Park, and S.-W. Kim are with the Department of Electronics Engineering, Korea University, Seoul 136-701, Korea. H. J. Chung and S. H. Yoon are with the Samsung Electronics Corporation, Kyungkido 449-711, Korea. J. Choi and D. Ahn are with the Department of Electronics Engineering, University of Seoul, Seoul 130-020, Korea. Publisher Item Identifier S 1521-3331(00)02688-X.

PY - 2000

Y1 - 2000

N2 - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

AB - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

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DO - 10.1109/6144.833059

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JO - IEEE Transactions on Components and Packaging Technologies

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ER -

Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Abstract

Bibliographical note

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