Functional nanowire microscopy tip

Joondong Kim, Moon Seop Hyun, Young Hyun Shin, Ju Hyung Yun, Chang Soo Han

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The practical application of nanostructure was achieved to adopt an electrical-conductive nanowire (NW) as a microscopy tip. The nanowire-sitting structure provided excellent topographic images and electrical information from a nanoscale object. Dielectrophoretic method was applied to align the nickel silicide (NiSi) NW on a Si cantilever. The NiSi NW containing solution was firstly prepared and dropped in the electric field applying space between a Si cantilever and a metal coated-Si substrate. This bottom-up assembly using a nanostructure may provide a promising route of assembling the nanostructure-embedding system.

Original languageEnglish
Title of host publicationNanotechnology 2009
Subtitle of host publicationFabrication, Particles, Characterization, MEMS, Electronics and Photonics - Technical Proceedings of the 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009
Pages389-392
Number of pages4
Publication statusPublished - 2009
Externally publishedYes
EventNanotechnology 2009: Fabrication, Particles, Characterization, MEMS, Electronics and Photonics - 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009 - Houston, TX, United States
Duration: 2009 May 32009 May 7

Publication series

NameNanotechnology 2009: Fabrication, Particles, Characterization, MEMS, Electronics and Photonics - Technical Proceedings of the 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009
Volume1

Other

OtherNanotechnology 2009: Fabrication, Particles, Characterization, MEMS, Electronics and Photonics - 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009
Country/TerritoryUnited States
CityHouston, TX
Period09/5/309/5/7

Keywords

  • Bottom-up assembly
  • Microscopy tip
  • Nanostructure-embedding system
  • Nanowire
  • Nickel silicide

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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