Abstract
Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.
Original language | English |
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Pages (from-to) | 839-844 |
Number of pages | 6 |
Journal | Microelectronics Journal |
Volume | 29 |
Issue number | 11 |
DOIs | |
Publication status | Published - 1998 Nov |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering