High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han; Jichai Jeong

doi:10.1002/mop.20470

High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han, Jichai Jeong

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

Original language	English
Pages (from-to)	365-367
Number of pages	3
Journal	Microwave and Optical Technology Letters
Volume	43
Issue number	5
DOIs	https://doi.org/10.1002/mop.20470
Publication status	Published - 2004 Dec 5

Keywords

Bonding
Circuit modeling
Coplanar waveguides
Packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1002/mop.20470

Cite this

@article{4577e22332134deca20c94b4a8c14018,

title = "High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package",

abstract = "Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.",

keywords = "Bonding, Circuit modeling, Coplanar waveguides, Packaging",

author = "Han, {Jae Ho} and Jichai Jeong",

year = "2004",

month = dec,

day = "5",

doi = "10.1002/mop.20470",

language = "English",

volume = "43",

pages = "365--367",

journal = "Microwave and Optical Technology Letters",

issn = "0895-2477",

publisher = "John Wiley and Sons Inc.",

number = "5",

}

TY - JOUR

T1 - High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

AU - Han, Jae Ho

AU - Jeong, Jichai

PY - 2004/12/5

Y1 - 2004/12/5

N2 - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

AB - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

KW - Bonding

KW - Circuit modeling

KW - Coplanar waveguides

KW - Packaging

UR - http://www.scopus.com/inward/record.url?scp=9144263124&partnerID=8YFLogxK

U2 - 10.1002/mop.20470

DO - 10.1002/mop.20470

M3 - Article

AN - SCOPUS:9144263124

SN - 0895-2477

VL - 43

SP - 365

EP - 367

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

IS - 5

ER -

High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Abstract

Keywords

ASJC Scopus subject areas

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