High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han; Jichai Jeong

doi:10.1002/mop.20470

High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han, Jichai Jeong

Department of Brain and Cognitive Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

Original language	English
Pages (from-to)	365-367
Number of pages	3
Journal	Microwave and Optical Technology Letters
Volume	43
Issue number	5
DOIs	https://doi.org/10.1002/mop.20470
Publication status	Published - 2004 Dec 5

Keywords

Bonding
Circuit modeling
Coplanar waveguides
Packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1002/mop.20470

Cite this

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abstract = "Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.",

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author = "Han, {Jae Ho} and Jichai Jeong",

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AU - Han, Jae Ho

AU - Jeong, Jichai

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N2 - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

AB - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

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KW - Circuit modeling

KW - Coplanar waveguides

KW - Packaging

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High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

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