High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han; Jichai Jeong

doi:10.1002/mop.20470

High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han^*
, Jichai Jeong

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

Original language	English
Pages (from-to)	365-367
Number of pages	3
Journal	Microwave and Optical Technology Letters
Volume	43
Issue number	5
DOIs	https://doi.org/10.1002/mop.20470
Publication status	Published - 2004 Dec 5

Keywords

Bonding
Circuit modeling
Coplanar waveguides
Packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1002/mop.20470

Cite this

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title = "High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package",

abstract = "Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.",

keywords = "Bonding, Circuit modeling, Coplanar waveguides, Packaging",

author = "Han, \{Jae Ho\} and Jichai Jeong",

year = "2004",

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T1 - High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

AU - Han, Jae Ho

AU - Jeong, Jichai

PY - 2004/12/5

Y1 - 2004/12/5

N2 - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

AB - Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

KW - Bonding

KW - Circuit modeling

KW - Coplanar waveguides

KW - Packaging

UR - https://www.scopus.com/pages/publications/9144263124

U2 - 10.1002/mop.20470

DO - 10.1002/mop.20470

M3 - Article

AN - SCOPUS:9144263124

SN - 0895-2477

VL - 43

SP - 365

EP - 367

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

IS - 5

ER -

High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Abstract

Keywords

ASJC Scopus subject areas

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