High Speed Ethernet Interface between TE and MT in 3GPP LTE Network

Yong Soo Baek; Sung Gi Min; Hyun Gu Lee

doi:10.1109/MESH.2009.11

High Speed Ethernet Interface between TE and MT in 3GPP LTE Network

Yong Soo Baek, Sung Gi Min, Hyun Gu Lee

Department of Computer Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Data rates in 3GPP LTE supports 100Mbps in the downlink and 50Mbps in the uplink. Currently, almost all manufactured MTs uses HDLC-PPP to make connections between TE and MT. However HDLC-PPP uses byte stuffing for HDLC framing. As the communication speed is increased dramtically between TE and MT, byte stuffing seriously limits communication speed. As the connection methods between TE and MT and between MT and RNC are different, HDLC-PPP used between TE and MT can be replaced by other method without affecting the wireless interface. We propose an Ethernet interface instead of HDLC-PPP interface. The Ethernet-based interface provides higher data throughput than that of HDLC-PPP. The test result shows that data throughputs of HDLC-PPP over USB, pure Ethernet, and Ethernet over USB are 18Mbps, 95Mbps, and 68Mbps respectively.

Original language	English
Title of host publication	Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009
Pages	19-23
Number of pages	5
DOIs	https://doi.org/10.1109/MESH.2009.11
Publication status	Published - 2009
Event	2009 2nd International Conference on Advances in Mesh Networks, MESH 2009 - Athens, Glyfada, Greece Duration: 2009 Jun 18 → 2009 Jun 23

Publication series

Name	Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009

Other

Other	2009 2nd International Conference on Advances in Mesh Networks, MESH 2009
Country/Territory	Greece
City	Athens, Glyfada
Period	09/6/18 → 09/6/23

ASJC Scopus subject areas

Computational Theory and Mathematics
Computer Networks and Communications
Computer Science Applications
Hardware and Architecture

Access to Document

10.1109/MESH.2009.11

Cite this

High Speed Ethernet Interface between TE and MT in 3GPP LTE Network. / Baek, Yong Soo; Min, Sung Gi; Lee, Hyun Gu.
Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009. 2009. p. 19-23 5223000 (Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Baek, YS, Min, SG & Lee, HG 2009, High Speed Ethernet Interface between TE and MT in 3GPP LTE Network. in Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009., 5223000, Proceedings - 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009, pp. 19-23, 2009 2nd International Conference on Advances in Mesh Networks, MESH 2009, Athens, Glyfada, Greece, 09/6/18. https://doi.org/10.1109/MESH.2009.11

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abstract = "Data rates in 3GPP LTE supports 100Mbps in the downlink and 50Mbps in the uplink. Currently, almost all manufactured MTs uses HDLC-PPP to make connections between TE and MT. However HDLC-PPP uses byte stuffing for HDLC framing. As the communication speed is increased dramtically between TE and MT, byte stuffing seriously limits communication speed. As the connection methods between TE and MT and between MT and RNC are different, HDLC-PPP used between TE and MT can be replaced by other method without affecting the wireless interface. We propose an Ethernet interface instead of HDLC-PPP interface. The Ethernet-based interface provides higher data throughput than that of HDLC-PPP. The test result shows that data throughputs of HDLC-PPP over USB, pure Ethernet, and Ethernet over USB are 18Mbps, 95Mbps, and 68Mbps respectively.",

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AB - Data rates in 3GPP LTE supports 100Mbps in the downlink and 50Mbps in the uplink. Currently, almost all manufactured MTs uses HDLC-PPP to make connections between TE and MT. However HDLC-PPP uses byte stuffing for HDLC framing. As the communication speed is increased dramtically between TE and MT, byte stuffing seriously limits communication speed. As the connection methods between TE and MT and between MT and RNC are different, HDLC-PPP used between TE and MT can be replaced by other method without affecting the wireless interface. We propose an Ethernet interface instead of HDLC-PPP interface. The Ethernet-based interface provides higher data throughput than that of HDLC-PPP. The test result shows that data throughputs of HDLC-PPP over USB, pure Ethernet, and Ethernet over USB are 18Mbps, 95Mbps, and 68Mbps respectively.

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High Speed Ethernet Interface between TE and MT in 3GPP LTE Network

Abstract

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