Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue

Chaeyun Shim, Yehhyun Jo, Hyo Kyeong Cha, Mi Kyung Kim, Hyojung Kim, Geon Kook, Kiup Kim, Gi Hoon Son, Hyunjoo J. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

There has been rapid advancement in the development of 3D neuronal cultures and brain organoids. However, conventional rigid 2D and 3D microelectrode arrays (MEAs) are not suitable for neural recording of free-form tissues due to limited contact with the tissue and poor media exchange. Here, we present a stretchable dual-MEA device suitable for non-invasive recording of free-form neural tissues for the first time. We achieve high stretchability by employing serpentine signal lines on a polyimide substrate and enable media exchange through perforated regions. A tissue sample was placed in between a pair of these stretchable MEAs to demonstrate successful 3D conformal contact and continuous media exchange.

Original languageEnglish
Title of host publication33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages380-383
Number of pages4
ISBN (Electronic)9781728135809
DOIs
Publication statusPublished - 2020 Jan
Event33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada
Duration: 2020 Jan 182020 Jan 22

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2020-January
ISSN (Print)1084-6999

Conference

Conference33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Country/TerritoryCanada
CityVancouver
Period20/1/1820/1/22

Keywords

  • 3D tissue
  • Organoid
  • microelectrode array (MEA)
  • signal recording
  • stretchable electronics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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