Hybrid segmentation scheme for skin features extraction using dermoscopy images

Jehyeok Rew, Hyungjoon Kim, Eenjun Hwang

    Research output: Contribution to journalArticlepeer-review

    4 Citations (Scopus)

    Abstract

    Objective and quantitative assessment of skin conditions is essential for cosmeceutical studies and research on skin aging and skin regeneration. Various handcraft-based image processing methods have been proposed to evaluate skin conditions objectively, but they have unavoidable disadvantages when used to analyze skin features accurately. This study proposes a hybrid segmentation scheme consisting of Deeplab v3+ with an Inception-ResNet-v2 backbone, LightGBM, and morphological processing (MP) to overcome the shortcomings of handcraft-based approaches. First, we apply Deeplab v3+ with an Inception-ResNet-v2 backbone for pixel segmentation of skin wrinkles and cells. Then, LightGBM and MP are used to enhance the pixel segmentation quality. Finally, we determine several skin features based on the results of wrinkle and cell segmentation. Our proposed segmentation scheme achieved a mean accuracy of 0.854, mean of intersection over union of 0.749, and mean boundary F1 score of 0.852, which achieved 1.1%, 6.7%, and 14.8% improvement over the panoptic-based semantic segmentation method, respectively.

    Original languageEnglish
    Pages (from-to)801-817
    Number of pages17
    JournalComputers, Materials and Continua
    Volume69
    Issue number1
    DOIs
    Publication statusPublished - 2021

    Bibliographical note

    Funding Information:
    Funding Statement: This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2020R1F1A1074885) and was supported by the Brain Korea 21 Project in 2021 (No. 4199990114242).

    Publisher Copyright:
    © 2021 Tech Science Press. All rights reserved.

    Keywords

    • Dermoscopy image
    • Feature extraction
    • Image segmentation
    • Skin texture

    ASJC Scopus subject areas

    • Biomaterials
    • Modelling and Simulation
    • Mechanics of Materials
    • Computer Science Applications
    • Electrical and Electronic Engineering

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