Hybrid segmentation scheme for skin features extraction using dermoscopy images

Jehyeok Rew, Hyungjoon Kim, Eenjun Hwang

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Objective and quantitative assessment of skin conditions is essential for cosmeceutical studies and research on skin aging and skin regeneration. Various handcraft-based image processing methods have been proposed to evaluate skin conditions objectively, but they have unavoidable disadvantages when used to analyze skin features accurately. This study proposes a hybrid segmentation scheme consisting of Deeplab v3+ with an Inception-ResNet-v2 backbone, LightGBM, and morphological processing (MP) to overcome the shortcomings of handcraft-based approaches. First, we apply Deeplab v3+ with an Inception-ResNet-v2 backbone for pixel segmentation of skin wrinkles and cells. Then, LightGBM and MP are used to enhance the pixel segmentation quality. Finally, we determine several skin features based on the results of wrinkle and cell segmentation. Our proposed segmentation scheme achieved a mean accuracy of 0.854, mean of intersection over union of 0.749, and mean boundary F1 score of 0.852, which achieved 1.1%, 6.7%, and 14.8% improvement over the panoptic-based semantic segmentation method, respectively.

Original languageEnglish
Pages (from-to)801-817
Number of pages17
JournalComputers, Materials and Continua
Issue number1
Publication statusPublished - 2021

Bibliographical note

Funding Information:
Funding Statement: This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2020R1F1A1074885) and was supported by the Brain Korea 21 Project in 2021 (No. 4199990114242).

Publisher Copyright:
© 2021 Tech Science Press. All rights reserved.


  • Dermoscopy image
  • Feature extraction
  • Image segmentation
  • Skin texture

ASJC Scopus subject areas

  • Biomaterials
  • Modelling and Simulation
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering


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