TY - GEN
T1 - Impact of solvent on silk materials
AU - Kim, Yoonjung
AU - Lee, Myeongsang
AU - Baek, Inchul
AU - Choi, Hyunsung
AU - Na, Sungsoo
N1 - Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) under Grant Nos., NRF-2014R1A2A1A11052389
Publisher Copyright:
© 2016 IEEE.
PY - 2016/12/7
Y1 - 2016/12/7
N2 - Natural silk is one of the toughest materials known, and combined with its unique properties such as biocompatibility, dyeability, silk is sought in many fields such as biomedical, textile industry, engineering and et cetera. Many groups have tried to mass produce synthetic silk matching the properties of natural silk, but have yet to succeed. This study focuses on investigating the effect of solvent on the properties of silk material, to better understand the ideal conditions for producing synthetic silk that matches natural silk, via molecular dynamics simulations, and through the use of methods such as Euler-Bernoulli beam theory, principal component analysis, hydrogen bond and RMSD analysis. We report the effect of solvent on each components of silk that can be applied to various types of silk.
AB - Natural silk is one of the toughest materials known, and combined with its unique properties such as biocompatibility, dyeability, silk is sought in many fields such as biomedical, textile industry, engineering and et cetera. Many groups have tried to mass produce synthetic silk matching the properties of natural silk, but have yet to succeed. This study focuses on investigating the effect of solvent on the properties of silk material, to better understand the ideal conditions for producing synthetic silk that matches natural silk, via molecular dynamics simulations, and through the use of methods such as Euler-Bernoulli beam theory, principal component analysis, hydrogen bond and RMSD analysis. We report the effect of solvent on each components of silk that can be applied to various types of silk.
UR - http://www.scopus.com/inward/record.url?scp=85010434732&partnerID=8YFLogxK
U2 - 10.1109/NMDC.2016.7777118
DO - 10.1109/NMDC.2016.7777118
M3 - Conference contribution
AN - SCOPUS:85010434732
T3 - Nanotechnology Materials and Devices Conference, NMDC 2016 - Conference Proceedings
BT - Nanotechnology Materials and Devices Conference, NMDC 2016 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th IEEE Nanotechnology Materials and Devices Conference, NMDC 2016
Y2 - 9 October 2016 through 12 October 2016
ER -