Improved electrical performance of low-temperature-cured silver electrode for silicon heterojunction solar cells

Yuanming Li, Hee Soo Kim, Junsin Yi, Donghwan Kim, Joo Youl Huh

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


To realize the high conversion efficiency potential of silicon heterojunction (SHJ) solar cells, it is crucial to minimize the series resistance by reducing the line resistivity and contact resistance of the Ag gridlines formed via low-temperature (<∼240 °C) curing. To reduce the resistivity and contact resistance of the screenprinted Ag gridlines on an indium tin oxide (ITO) layer, two strategies are utilized in this study: 1) the addition of Ag nanoparticles (NPs) into a low-temperature-curing polymer-based Ag paste for the resistivity and 2) the insertion of a thin Ag contact layer by inkjet printing between the screenprinted Ag gridline and the ITO layer for contact resistance. The effectiveness of these approaches was examined by curing the Ag gridlines at various temperatures in the range of 160-220 °C for 10 min. After curing at 200 °C, the low resistivity of 2.2 μ Ω·cm and specific contact resistance of 0.55 mΩ·cm2 were obtained by adding 20 wt.% of Ag NPs and inserting the inkjet-printed Ag contact layer, respectively. Microstructural analyses were also performed to correlate the outstanding electrical properties of the Ag gridlines.

Original languageEnglish
Pages (from-to)969-975
Number of pages7
JournalIEEE Journal of Photovoltaics
Issue number4
Publication statusPublished - 2018 Jul

Bibliographical note

Funding Information:
Manuscript received March 12, 2018; revised May 3, 2018; accepted May 6, 2018. Date of publication May 28, 2018; date of current version June 19, 2018. This work was supported in part by the National Research Foundation of Korea and in part by the New & Renewable Energy Core Technology Program of Korea Institute of Energy Technology Evaluation and Planning under Grant 2017R1A2B3002980 and Grant 20143030011960 funded by the MSIT and MOTIE, respectively, of the Korea government. (Corresponding author: Joo-Youl Huh.) Y. Li, H.-S. Kim, D. Kim, and J.-Y. Huh are with the Department of Materials Science and Engineering, Korea University, Seoul 02841, South Korea (e-mail:,;; donghwan@korea.;

Publisher Copyright:
© 2011-2012 IEEE.


  • Ag electrode
  • contact resistance
  • low-temperature-curing
  • microstructure
  • screen printing
  • silicon heterojunction (SHJ) solar cell

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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