Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

Yunsung Kim; Hyelim Choi; Hyoungjoo Lee; Dongjun Shin; Jinhan Cho; Heeman Choe

doi:10.1016/j.microrel.2012.03.001

Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe

Department of Chemical and Biological Engineering

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn-3.0Ag and Sn-1.0In with that of a baseline Sn-3.0Ag-0.5Cu solder joint under a severe temperature cycling range of -55 to +150°C. Both Cu-cored solder joints can be considered a potential solution to interconnects in microelectronic semiconductor packages used under harsh thermal conditions on account of their greater resistance to thermal stress caused by the severe temperature cycling than the baseline Sn-3.0Ag-0.5Cu solder joint.

Original language	English
Pages (from-to)	1441-1444
Number of pages	4
Journal	Microelectronics Reliability
Volume	52
Issue number	7
DOIs	https://doi.org/10.1016/j.microrel.2012.03.001
Publication status	Published - 2012 Jul

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.microrel.2012.03.001

Cite this

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title = "Improved reliability of copper-cored solder joints under a harsh thermal cycling condition",

abstract = "This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn-3.0Ag and Sn-1.0In with that of a baseline Sn-3.0Ag-0.5Cu solder joint under a severe temperature cycling range of -55 to +150°C. Both Cu-cored solder joints can be considered a potential solution to interconnects in microelectronic semiconductor packages used under harsh thermal conditions on account of their greater resistance to thermal stress caused by the severe temperature cycling than the baseline Sn-3.0Ag-0.5Cu solder joint.",

author = "Yunsung Kim and Hyelim Choi and Hyoungjoo Lee and Dongjun Shin and Jinhan Cho and Heeman Choe",

note = "Funding Information: This study was supported by the International Research & Development Program of the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (MEST) of Korea. HC also acknowledges the support from the Priority Research Centers Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (2009-0093814; 2010-0029106).",

year = "2012",

month = jul,

doi = "10.1016/j.microrel.2012.03.001",

language = "English",

volume = "52",

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journal = "Microelectronics and Reliability",

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AU - Kim, Yunsung

AU - Choi, Hyelim

AU - Lee, Hyoungjoo

AU - Shin, Dongjun

AU - Cho, Jinhan

AU - Choe, Heeman

N1 - Funding Information: This study was supported by the International Research & Development Program of the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (MEST) of Korea. HC also acknowledges the support from the Priority Research Centers Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (2009-0093814; 2010-0029106).

PY - 2012/7

Y1 - 2012/7

N2 - This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn-3.0Ag and Sn-1.0In with that of a baseline Sn-3.0Ag-0.5Cu solder joint under a severe temperature cycling range of -55 to +150°C. Both Cu-cored solder joints can be considered a potential solution to interconnects in microelectronic semiconductor packages used under harsh thermal conditions on account of their greater resistance to thermal stress caused by the severe temperature cycling than the baseline Sn-3.0Ag-0.5Cu solder joint.

AB - This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn-3.0Ag and Sn-1.0In with that of a baseline Sn-3.0Ag-0.5Cu solder joint under a severe temperature cycling range of -55 to +150°C. Both Cu-cored solder joints can be considered a potential solution to interconnects in microelectronic semiconductor packages used under harsh thermal conditions on account of their greater resistance to thermal stress caused by the severe temperature cycling than the baseline Sn-3.0Ag-0.5Cu solder joint.

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U2 - 10.1016/j.microrel.2012.03.001

DO - 10.1016/j.microrel.2012.03.001

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SN - 0026-2714

VL - 52

SP - 1441

EP - 1444

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

IS - 7

ER -

Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

Abstract

ASJC Scopus subject areas

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