Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn-3.0Ag and Sn-1.0In with that of a baseline Sn-3.0Ag-0.5Cu solder joint under a severe temperature cycling range of -55 to +150°C. Both Cu-cored solder joints can be considered a potential solution to interconnects in microelectronic semiconductor packages used under harsh thermal conditions on account of their greater resistance to thermal stress caused by the severe temperature cycling than the baseline Sn-3.0Ag-0.5Cu solder joint.

Original languageEnglish
Pages (from-to)1441-1444
Number of pages4
JournalMicroelectronics Reliability
Issue number7
Publication statusPublished - 2012 Jul

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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