Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing
- Won Jun Choi
- , Myong Jae Yoo
- , Joonho Bae
- , Ji Hun Seo
- , Churl Seung Lee*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
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