Interlayer magnetostatic fields in submicron cells for high density magnetic random access memory

D. H. Lee, S. H. Lim

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    A commercial program package based on finite element method (COMSOL) is used to calculate magnetic field intensity resulting from the free poles formed at the magnetic cell edges. The magnetic cell stack and dimensions are relevant to high density magnetic random access memory applications. The calculated field intensity is found to be large, indicating the importance of considering magnetostatic interactions in device applications.

    Original languageEnglish
    Title of host publication2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
    Pages612-613
    Number of pages2
    DOIs
    Publication statusPublished - 2006
    Event2006 IEEE Nanotechnology Materials and Devices Conference, NMDC - Gyeongju, Korea, Republic of
    Duration: 2006 Oct 222006 Oct 25

    Publication series

    Name2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
    Volume1

    Other

    Other2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
    Country/TerritoryKorea, Republic of
    CityGyeongju
    Period06/10/2206/10/25

    Keywords

    • Finite element method calculation
    • Magnetic random access memo
    • Magnetic tunnel junctions
    • Magnetostatic interactions

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • General Materials Science

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