Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho; Jin Woo Cho; Jun Hua Wu; Ji Ung Cho; Young Jin Choi; Young Keun Kim

doi:10.1016/j.cap.2009.03.026

Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho, Jin Woo Cho, Jun Hua Wu, Ji Ung Cho, Young Jin Choi, Young Keun Kim

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

Original language	English
Pages (from-to)	57-59
Number of pages	3
Journal	Current Applied Physics
Volume	10
Issue number	1
DOIs	https://doi.org/10.1016/j.cap.2009.03.026
Publication status	Published - 2010 Jan

Bibliographical note

Funding Information:
This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).

Keywords

Electrodeposition
Hardness
Magnetism
Texture
Thin films

ASJC Scopus subject areas

General Materials Science
General Physics and Astronomy

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10.1016/j.cap.2009.03.026

Cite this

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title = "Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition",

abstract = "We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.",

keywords = "Electrodeposition, Hardness, Magnetism, Texture, Thin films",

author = "Cho, {Moon Kyu} and Cho, {Jin Woo} and Wu, {Jun Hua} and Cho, {Ji Ung} and Choi, {Young Jin} and Kim, {Young Keun}",

note = "Funding Information: This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).",

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doi = "10.1016/j.cap.2009.03.026",

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AU - Cho, Moon Kyu

AU - Cho, Jin Woo

AU - Wu, Jun Hua

AU - Cho, Ji Ung

AU - Choi, Young Jin

AU - Kim, Young Keun

N1 - Funding Information: This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).

PY - 2010/1

Y1 - 2010/1

N2 - We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

AB - We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

KW - Electrodeposition

KW - Hardness

KW - Magnetism

KW - Texture

KW - Thin films

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DO - 10.1016/j.cap.2009.03.026

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JO - Current Applied Physics

JF - Current Applied Physics

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Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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