Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho, Jin Woo Cho, Jun Hua Wu, Ji Ung Cho, Young Jin Choi, Young Keun Kim

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

Original languageEnglish
Pages (from-to)57-59
Number of pages3
JournalCurrent Applied Physics
Issue number1
Publication statusPublished - 2010 Jan

Bibliographical note

Funding Information:
This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).


  • Electrodeposition
  • Hardness
  • Magnetism
  • Texture
  • Thin films

ASJC Scopus subject areas

  • General Materials Science
  • General Physics and Astronomy


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