Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Myong Jae Yoo; Sang Hyun Kim; Seong Dae Park; Woo Sung Lee; Jong Woo Sun; Jae Hong Choi; Sahn Nahm

doi:10.1016/j.eurpolymj.2010.02.001

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Myong Jae Yoo, Sang Hyun Kim, Seong Dae Park, Woo Sung Lee, Jong Woo Sun, Jae Hong Choi, Sahn Nahm

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

58 Citations (Scopus)

Abstract

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.

Original language	English
Pages (from-to)	1158-1162
Number of pages	5
Journal	European Polymer Journal
Volume	46
Issue number	5
DOIs	https://doi.org/10.1016/j.eurpolymj.2010.02.001
Publication status	Published - 2010 May

Keywords

Activation energy
Cure kinetics
Cycloaliphatic epoxy resin
Differential scanning calorimetry

ASJC Scopus subject areas

Physics and Astronomy(all)
Organic Chemistry
Polymers and Plastics
Materials Chemistry

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10.1016/j.eurpolymj.2010.02.001

Cite this

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title = "Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis",

abstract = "Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.",

keywords = "Activation energy, Cure kinetics, Cycloaliphatic epoxy resin, Differential scanning calorimetry",

author = "Yoo, {Myong Jae} and Kim, {Sang Hyun} and Park, {Seong Dae} and Lee, {Woo Sung} and Sun, {Jong Woo} and Choi, {Jae Hong} and Sahn Nahm",

year = "2010",

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doi = "10.1016/j.eurpolymj.2010.02.001",

language = "English",

volume = "46",

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journal = "European Polymer Journal",

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T1 - Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

AU - Yoo, Myong Jae

AU - Kim, Sang Hyun

AU - Park, Seong Dae

AU - Lee, Woo Sung

AU - Sun, Jong Woo

AU - Choi, Jae Hong

AU - Nahm, Sahn

PY - 2010/5

Y1 - 2010/5

N2 - Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.

AB - Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.

KW - Activation energy

KW - Cure kinetics

KW - Cycloaliphatic epoxy resin

KW - Differential scanning calorimetry

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DO - 10.1016/j.eurpolymj.2010.02.001

M3 - Article

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SN - 0014-3057

VL - 46

SP - 1158

EP - 1162

JO - European Polymer Journal

JF - European Polymer Journal

IS - 5

ER -

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Abstract

Keywords

ASJC Scopus subject areas

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