Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Myong Jae Yoo, Sang Hyun Kim, Seong Dae Park, Woo Sung Lee, Jong Woo Sun, Jae Hong Choi, Sahn Nahm

Research output: Contribution to journalArticlepeer-review

62 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds