TY - GEN
T1 - Investigation of fracture mechanism of HDPE subjected to environmental stress cracking
AU - Choi, Byoung Ho
AU - Weinhold, Jeffrey
AU - Reuschief, David
AU - Kapur, Mridula
PY - 2007
Y1 - 2007
N2 - Environmental stress crack resistance (ESCR) is a commonly used test to characterize cracking failure of high density polyethylene (HDPE) used in rigid packaging applications. From a resin design standpoint it is important to understand the mechanism of environmental stress cracking (ESC) especially in the case of materials with significantly different ESCR values. In this report, the morphology of ESC is studied by scanning electron microscopy (SEM). A model to predict polymer ESCR using tie chain concentration considering the permeability of IGEPAL® solution is proposed.
AB - Environmental stress crack resistance (ESCR) is a commonly used test to characterize cracking failure of high density polyethylene (HDPE) used in rigid packaging applications. From a resin design standpoint it is important to understand the mechanism of environmental stress cracking (ESC) especially in the case of materials with significantly different ESCR values. In this report, the morphology of ESC is studied by scanning electron microscopy (SEM). A model to predict polymer ESCR using tie chain concentration considering the permeability of IGEPAL® solution is proposed.
UR - http://www.scopus.com/inward/record.url?scp=34648840082&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34648840082&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:34648840082
SN - 1604232145
SN - 9781604232141
T3 - Annual Technical Conference - ANTEC, Conference Proceedings
SP - 269
EP - 273
BT - Society of Plastics Engineers Annual Technical Conference
T2 - Society of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007
Y2 - 6 May 2007 through 11 May 2007
ER -