Kinetic study of the effect of catalysts on the curing of biphenyl epoxy resin

Seung Han, Whan Gun Kim, Ho Gyu Yoon, Tak Jin Moon

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47 Citations (Scopus)


The investigation of cure kinetics of biphenyl epoxy (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl)dicyclopentadiene type phenolic resin system with different kinds of catalysts was performed by a differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP), 1-benzyl-2-methylimidazole (1B2MI), and tris(4-methoxyphenyl)phosphine (TPAP) as a catalyst proceeds through an nth-order kinetic mechanism, whereas that of the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used semiempirical relationship proposed by Chern and Poehlein. By combining an nth-order kinetic model or an auto-catalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

Original languageEnglish
Pages (from-to)1125-1137
Number of pages13
JournalJournal of Applied Polymer Science
Issue number7
Publication statusPublished - 1998 May 16


  • Biphenyl epoxy resin
  • Catalyst
  • Cure kinetics
  • Dicyclopentadiene-type phenolic resin

ASJC Scopus subject areas

  • General Chemistry
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry


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