Lifetime prediction model of thermal fatigue stress on crystalline silicon photovoltaic module

Nochang Park, Changwoon Han, Jaeseong Jeong, Donghwan Kim

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)

    Abstract

    Thermal cycling stress can result in fatigue cracks of interconnections between ribbon wires and the metallization of a photovoltaic (PV) module, thereby increasing its series resistance. Therefore, in this study, the thermal cycling (TC) history of PV modules exposed to two benchmark climate (Phoenix, AZ) has been derived employing corresponding meteorological data. Using the three parameters rain-flow counting algorithm, the number of TCs versus temperature change was calculated over one year. The number of rain-flow cycles was 935 in Phoenix. Furthermore, three types of accelerated tests were conducted to develop a lifetime prediction model. The Basquin equation was used to predict the number of cycles to failure, based on stress calculation. A finite element model for stress analysis was developed. Failure analysis shows that crack occurred at the solder joint after accelerated test.

    Original languageEnglish
    Title of host publication39th IEEE Photovoltaic Specialists Conference, PVSC 2013
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1575-1578
    Number of pages4
    ISBN (Print)9781479932993
    DOIs
    Publication statusPublished - 2013
    Event39th IEEE Photovoltaic Specialists Conference, PVSC 2013 - Tampa, FL, United States
    Duration: 2013 Jun 162013 Jun 21

    Publication series

    NameConference Record of the IEEE Photovoltaic Specialists Conference
    ISSN (Print)0160-8371

    Other

    Other39th IEEE Photovoltaic Specialists Conference, PVSC 2013
    Country/TerritoryUnited States
    CityTampa, FL
    Period13/6/1613/6/21

    Keywords

    • Accelerated test
    • Fatigue
    • Lifetime
    • PV module
    • Solder joint

    ASJC Scopus subject areas

    • Control and Systems Engineering
    • Industrial and Manufacturing Engineering
    • Electrical and Electronic Engineering

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