Low Cost Hardware Implementation of LEA-128 Encryption using Bit-Serial Technique

Byungjun Choi, Bohun Kim, Jongsun Park

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    The Lightweight Encryption Algorithm (LEA) is a block cipher algorithm developed to provide confidentiality in high-speed environments, big data, cloud, and mobile devices. There is an issue that these security algorithms' modules must be small in area and power in order to be loaded onto resource constraint devices such as passive RFID. In this paper, for the first time in LEA which is one of the block ciphers, Bit-Serial technique is used to realize small area and power. Using Samsung 65nm process, we could obtain 2240GE which is 49.8% less in terms of area compared to the state-of-the-art area-optimized LEA-128. The IP designed in this paper can be applied as a security module to resource constraint devices.

    Original languageEnglish
    Title of host publicationProceedings - International SoC Design Conference 2018, ISOCC 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages46-47
    Number of pages2
    ISBN (Electronic)9781538679609
    DOIs
    Publication statusPublished - 2018 Jul 2
    Event15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of
    Duration: 2018 Nov 122018 Nov 15

    Publication series

    NameProceedings - International SoC Design Conference 2018, ISOCC 2018

    Conference

    Conference15th International SoC Design Conference, ISOCC 2018
    Country/TerritoryKorea, Republic of
    CityDaegu
    Period18/11/1218/11/15

    Bibliographical note

    Funding Information:
    ACKNOWLEDGMENT This work was supported as part of Military Crypto Research Center(UD170109ED) funded by Defense Acquisition Program Administration(DAPA) and Agency for Defense Development(ADD).

    Publisher Copyright:
    © 2018 IEEE.

    Keywords

    • Bit-Serial
    • LEA

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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