Low-K and Low-loss LTCC materials based on dolomite-type boron compounds

H. T. Kim, M. H. Nam, S. Nahm, J. H. Nam, D. H. Yeo, H. S. Shin, J. H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Dolomite-type boron compounds, M2+N4+(BO 3)2, were synthesized via conventional solid oxide reaction route and the structure and microwave dielectric properties were investigated. Small amounts of sintering additives were applied to reduce the firing temperatures under 900 degree C for LTCC application. Some of the dolomite borates demonstrated with promising microwave dielectric properties with low-K near10, quality factors over 500 at the GHz region, and stable temperature coefficients of resonant frequencies within 10 ppm per degree C. In this work, the syntheses, sintering properties, microstructures, and dielectric properties of dolomite-type borates and the system with the substitution of A-site and/or B-site cations will be presented. The compatibility of the system with silver electrode was also explored.

Original languageEnglish
Title of host publicationInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Pages145-148
Number of pages4
Publication statusPublished - 2007
Event3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007 - Denver, CO, United States
Duration: 2007 Apr 232007 Apr 26

Publication series

NameInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Other

Other3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Country/TerritoryUnited States
CityDenver, CO
Period07/4/2307/4/26

Keywords

  • Ceramic
  • Dielectric properties
  • Dolomite-type
  • LTCC
  • Microwave

ASJC Scopus subject areas

  • Hardware and Architecture
  • Ceramics and Composites

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