Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF₆ plasma

Keyphrases

• Low Temperature 100%
• Process-based 100%
• SF6 Plasma 100%
• Smoothing Methods 100%
• Dry Etching Process 100%
• Deep Reactive Ion Etching 100%
• Reactive Ion Etching 80%
• Silicon Micromachining 40%
• Smoothing Effect 40%
• Sidewall 20%
• Dry Etching 20%
• Device Performance 20%
• Gas Flow 20%
• Low Temperature Process 20%
• Effective Method 20%
• Radio Frequency Power 20%
• High Aspect Ratio 20%
• Power Flow 20%
• Etching Treatment 20%
• Sulfur Hexafluoride SF6 20%
• Bosch Process 20%

Engineering

• Dry Etching 100%
• Low-Temperature 100%
• Etching Process 100%
• Deep Reactive Ion Etching 100%
• Micro Machining 40%
• Side Wall 20%
• Applicability 20%
• Radio Frequency 20%
• Device Performance 20%
• Gas Flow 20%
• High Aspect Ratio 20%
• Etching Treatment 20%