Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma
- Jin Soo Park
- , Dong Hyun Kang
- , Seung Min Kwak
- , Tae Song Kim
- , Jung Ho Park
- , Tae Geun Kim
- , Seung Hyub Baek
- , Byung Chul Lee*
*Corresponding author for this work
Research output: Contribution to journal › Letter › peer-review
26
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