Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics
Gwan Jin Ko, Heeseok Kang, Won Bae Han, Ankan Dutta, Jeong Woong Shin, Tae Min Jang, Sungkeun Han, Jun Hyeon Lim, Chan Hwi Eom, So Jeong Choi, Yelynn Ryu, Woon Hong Yeo, Huanyu Cheng*, Suk Won Hwang*
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