Materials and fabrication processes for transient and bioresorbable high-performance electronics

Suk Won Hwang, Dae Hyeong Kim, Hu Tao, Tae Il Kim, Stanley Kim, Ki Jun Yu, Bruce Panilaitis, Jae Woong Jeong, Jun Kyul Song, Fiorenzo G. Omenetto, John A. Rogers

Research output: Contribution to journalArticlepeer-review

216 Citations (Scopus)


Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, "transient" electronic devices.

Original languageEnglish
Pages (from-to)4087-4093
Number of pages7
JournalAdvanced Functional Materials
Issue number33
Publication statusPublished - 2013 Sept 6
Externally publishedYes


  • biocompatible electronics
  • bioresorbable electronics
  • fully formed electronic devices
  • transient electronics

ASJC Scopus subject areas

  • General Chemistry
  • General Materials Science
  • Condensed Matter Physics


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