Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics

Won Bae Han, Gwan Jin Ko, Seung Min Yang, Heeseok Kang, Joong Hoon Lee, Jeong Woong Shin, Tae Min Jang, Sungkeun Han, Dong Je Kim, Jun Hyeon Lim, Kaveti Rajaram, Amay Jairaj Bandodkar, Suk Won Hwang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Although biodegradable, transient electronic devices must dissolve or decompose via environmental factors, an effective waterproofing or encapsulation system is essential for reliable, durable operation for a desired period of time. Existing protection approaches use multiple or alternate layers of electrically inactive organic/inorganic elements combined with polymers; however, their high mechanical stiffness is not suitable for soft, time-dynamic biological tissues/skins/organs. Here, we introduce a stretchable, bioresorbable encapsulant using nanoparticle-incorporated elastomeric composites with modifications of surface morphology. Nature-inspired micropatterns reduce the diffusion area for water molecules, and embedded nanoparticles impede water permeation, which synergistically enhances the water-barrier performance. Empirical and theoretical evaluations validate the encapsulation mechanisms under strains. Demonstration of a soft, degradable shield with an optical component under a biological solution highlights the potential applicability of the proposed encapsulation strategy.

Original languageEnglish
Pages (from-to)14822-14830
Number of pages9
JournalACS nano
Volume17
Issue number15
DOIs
Publication statusPublished - 2023 Aug 8

Bibliographical note

Publisher Copyright:
© 2023 American Chemical Society.

Keywords

  • biodegradable elastomer
  • biodegradable electronics
  • polymer composite
  • stretchable encapsulation
  • transient electronics

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering
  • General Physics and Astronomy

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