Abstract
Lateral type polysilicon field emitters were fabricated and tested in various vacuum levels for the application of a microvacuum sensor. The design and fabrication of the sensor were easy owing to the surface micromachining technique. Field distributions were also characterized by a 3D electromagnetic field simulation tool.
Original language | English |
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Pages (from-to) | 542-545 |
Number of pages | 4 |
Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 19 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2001 Mar |
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering