Abstract
This paper presents an mm-wave CMOS matrix distributed amplifier (matrix-DA) exhibiting an ultra-wide bandwidth. The amplifier consists of multi-Tiered DAs and an on-chip inductive bias network. The distributed line length is optimized for dealing with a tradeoff between the impedance matching and bandwidth. The output signals from each gain cell are coherently added by adopting the group-delay equalization technique. Peaking lines are inserted at the interstage network to increase the gain-bandwidth product (GBP). The experimental results show that a nominal gain of 6.2 dB and a 3-dB bandwidth of 70 GHz is achieved. The GBP reaches 142.9 GHz. The return loss is higher than 10 dB over the entire 3-dB bandwidth. The chip size is 0.81 mm2.
| Original language | English |
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| Title of host publication | RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 200-203 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781665466493 |
| DOIs | |
| Publication status | Published - 2022 |
| Event | 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of Duration: 2022 Aug 29 → 2022 Aug 31 |
Publication series
| Name | RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology |
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Conference
| Conference | 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 |
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| Country/Territory | Korea, Republic of |
| City | Busan |
| Period | 22/8/29 → 22/8/31 |
Bibliographical note
Publisher Copyright:© 2022 IEEE.
Keywords
- CMOS 65nm process technology
- gain-bandwidth product
- group-delay equalization
- matrix distributed amplifier
ASJC Scopus subject areas
- Computer Networks and Communications
- Hardware and Architecture
- Signal Processing
- Electrical and Electronic Engineering
- Instrumentation