Modified low-temperature direct bonding method for vacuum microelectronics application

Byeong Kwon Ju, Duck Jung Lee, Woo Beom Choi, Yun-Hi Lee, Jin Jang, Kwang Bae Lee, Myung Hwan Oh

Research output: Contribution to journalConference articlepeer-review


This paper presents the process and experimental results for the improved silicon-to-glass bonding using silicon direct bonding (SDB) followed by anodic bonding. The initial bonding between glass and silicon was caused by the hydrophilic surfaces of silicon-glass ensemble using SDB method. Then the initially bonded specimen had be to strongly bonded by anodic bonding process. The effects of the bonding process parameters on the interface energy were investigated as functions of the bonding temperature and voltage. We found that the specimen which was bonded using SDB process followed by anodic bonding process had higher interface energy than one using anodic bonding process only. The main factor contributing to the higher interface energy in the glass-to-silicon assemble bonded by SDB followed by anodic bonding was investigated by secondary ion mass spectroscopy (SIMS) analysis.

Original languageEnglish
Pages (from-to)342-348
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 1997 Jun 19
EventSmart Structures and Materials 1997: Smart Electronics and MEMS - San Diego, United States
Duration: 1997 Mar 31997 Mar 6


  • Anodic bonding
  • Silicon direct bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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