Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

Seong Jin Kim, Min Hyung Cho, Jang Hyuk Yoon, Ho Jang

    Research output: Contribution to journalArticlepeer-review

    5 Citations (Scopus)

    Abstract

    Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by Müller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 Å) for appearance of the stripes.

    Original languageEnglish
    Pages (from-to)1105-1109
    Number of pages5
    JournalScripta Materialia
    Volume52
    Issue number11
    DOIs
    Publication statusPublished - 2005 Jun

    Bibliographical note

    Funding Information:
    This work was supported by a Korea University Grant in 2004.

    Copyright:
    Copyright 2008 Elsevier B.V., All rights reserved.

    Keywords

    • Interfaces
    • Molecular dynamics
    • Strain relaxation
    • Thin films

    ASJC Scopus subject areas

    • General Materials Science
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering
    • Metals and Alloys

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