Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

Seong Jin Kim; Min Hyung Cho; Jang Hyuk Yoon; Ho Jang

doi:10.1016/j.scriptamat.2005.02.012

Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

Seong Jin Kim, Min Hyung Cho, Jang Hyuk Yoon, Ho Jang

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by Müller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 Å) for appearance of the stripes.

Original language	English
Pages (from-to)	1105-1109
Number of pages	5
Journal	Scripta Materialia
Volume	52
Issue number	11
DOIs	https://doi.org/10.1016/j.scriptamat.2005.02.012
Publication status	Published - 2005 Jun

Bibliographical note

Funding Information:
This work was supported by a Korea University Grant in 2004.

Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.

Keywords

Interfaces
Molecular dynamics
Strain relaxation
Thin films

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2005.02.012

Cite this

@article{369a92381a0c4d57a45fcf2ee0017541,

title = "Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)",

abstract = "Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by M{\"u}ller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 {\AA}) for appearance of the stripes.",

keywords = "Interfaces, Molecular dynamics, Strain relaxation, Thin films",

author = "Kim, {Seong Jin} and Cho, {Min Hyung} and Yoon, {Jang Hyuk} and Ho Jang",

year = "2005",

month = jun,

doi = "10.1016/j.scriptamat.2005.02.012",

language = "English",

volume = "52",

pages = "1105--1109",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "11",

}

TY - JOUR

T1 - Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

AU - Kim, Seong Jin

AU - Cho, Min Hyung

AU - Yoon, Jang Hyuk

AU - Jang, Ho

PY - 2005/6

Y1 - 2005/6

N2 - Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by Müller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 Å) for appearance of the stripes.

AB - Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by Müller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 Å) for appearance of the stripes.

KW - Interfaces

KW - Molecular dynamics

KW - Strain relaxation

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=15344344079&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2005.02.012

DO - 10.1016/j.scriptamat.2005.02.012

M3 - Article

AN - SCOPUS:15344344079

SN - 1359-6462

VL - 52

SP - 1105

EP - 1109

JO - Scripta Materialia

JF - Scripta Materialia

IS - 11

ER -

Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this