MR head wafer fabrication technology: Current and future perspectives

Gunther Baubock; Huan Q. Dang; David C. Hinson; Laurence L. Rea; Young K. Kim

doi:10.1109/20.477545

MR head wafer fabrication technology: Current and future perspectives

Gunther Baubock, Huan Q. Dang, David C. Hinson, Laurence L. Rea, Young K. Kim

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Areal storage densities and yield requirements continuously drive process optimizations in volume manufacturing of magnetoresistive (MR) heads. Several topics related to the manufacturability of MR heads are discussed. A dependable supply of MR sputter targets with low magnetostriction λ_s is critical. By using an internally developed technique, λ_s can be predicted to within ±1.0 x 10^-7. MR film thickness uniformity can be improved by 60% by synchronizing the shutter activation with the substrate table. The profile of the photoresist for the read trackwidth definition is affected by initial exposure dose and post expose bake temperature. The use of mass-spectrometric and optical emission endpoint detection methods during ion beam etching of the MR layers allows a precise determination of the stopping point without overmilling into the layer underneath.

Original language	English
Pages (from-to)	25-30
Number of pages	6
Journal	IEEE Transactions on Magnetics
Volume	32
Issue number	1
DOIs	https://doi.org/10.1109/20.477545
Publication status	Published - 1996
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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AU - Rea, Laurence L.

AU - Kim, Young K.

PY - 1996

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AB - Areal storage densities and yield requirements continuously drive process optimizations in volume manufacturing of magnetoresistive (MR) heads. Several topics related to the manufacturability of MR heads are discussed. A dependable supply of MR sputter targets with low magnetostriction λs is critical. By using an internally developed technique, λs can be predicted to within ±1.0 x 10-7. MR film thickness uniformity can be improved by 60% by synchronizing the shutter activation with the substrate table. The profile of the photoresist for the read trackwidth definition is affected by initial exposure dose and post expose bake temperature. The use of mass-spectrometric and optical emission endpoint detection methods during ion beam etching of the MR layers allows a precise determination of the stopping point without overmilling into the layer underneath.

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MR head wafer fabrication technology: Current and future perspectives

Abstract

ASJC Scopus subject areas

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