Ever decreasing of microelectronics devices is challenged by overheating and demands an increase in heat removal rate. Herein, we fabricated highly efficient heat-removal coatings comprised of copper oxide-plated polymer nanofiber layers (thorny devil nanofibers) with high surface-to-volume ratio, which facilitate heat removal from the underlying hot surfaces. The electroplating time and voltage were optimized to form fiber layers with maximal heat removal rate. The copper oxide nanofibers with the thorny devil morphology yielded a superior cooling rate compared to the pure copper nanofibers with the smooth surface morphology. This superior cooling performance is attributed to the enhanced surface area of the thorny devil nanofibers. These nanofibers were characterized with scanning electron microscopy, X-ray diffraction, atomic force microscopy, and a thermographic camera.
|Journal||Journal of Applied Physics|
|Publication status||Published - 2016 Feb 14|
ASJC Scopus subject areas
- Physics and Astronomy(all)