Neural probes for chronic applications

  • Geon Kook
  • , Sung Woo Lee
  • , Hee Chul Lee
  • , Il Joo Cho
  • , Hyunjoo Jenny Lee*
  • *Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

48 Citations (Scopus)

Abstract

Developed over approximately half a century, neural probe technology is now a mature technology in terms of its fabrication technology and serves as a practical alternative to the traditional microwires for extracellular recording. Through extensive exploration of fabrication methods, structural shapes, materials, and stimulation functionalities, neural probes are now denser, more functional and reliable. Thus, applications of neural probes are not limited to extracellular recording, brain-machine interface, and deep brain stimulation, but also include a wide range of new applications such as brain mapping, restoration of neuronal functions, and investigation of brain disorders. However, the biggest limitation of the current neural probe technology is chronic reliability; neural probes that record with high fidelity in acute settings often fail to function reliably in chronic settings. While chronic viability is imperative for both clinical uses and animal experiments, achieving one is a major technological challenge due to the chronic foreign body response to the implant. Thus, this review aims to outline the factors that potentially affect chronic recording in chronological order of implantation, summarize the methods proposed to minimize each factor, and provide a performance comparison of the neural probes developed for chronic applications.

Original languageEnglish
Article number179
JournalMicromachines
Volume7
Issue number10
DOIs
Publication statusPublished - 2016 Oct 2
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2016 by the authors.

Keywords

  • Biocompatibility
  • Biocompatible coating
  • Chronic implant
  • Foreign body response
  • Neural probe
  • Neural recording

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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