New current-mode sense amplifiers for high density DRAM and PIM architectures

S. M. Yo; C. Kim; S. O. Jung; K. H. Baek; S. M. Kang

New current-mode sense amplifiers for high density DRAM and PIM architectures

S. M. Yo, C. Kim, S. O. Jung, K. H. Baek, S. M. Kang

Research output: Contribution to journal › Conference article › peer-review

Abstract

This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

Original language	English
Pages (from-to)	IV938-IV941
Journal	Materials Research Society Symposium - Proceedings
Volume	626
Publication status	Published - 2001
Externally published	Yes
Event	Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications - San Francisco, CA, United States Duration: 2000 Apr 24 → 2000 Apr 27

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

@article{58d11274eb16400d9d67501a5a7d76e9,

title = "New current-mode sense amplifiers for high density DRAM and PIM architectures",

abstract = "This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.",

author = "Yo, {S. M.} and C. Kim and Jung, {S. O.} and Baek, {K. H.} and Kang, {S. M.}",

year = "2001",

language = "English",

volume = "626",

pages = "IV938--IV941",

journal = "Materials Research Society Symposium Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications ; Conference date: 24-04-2000 Through 27-04-2000",

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TY - JOUR

T1 - New current-mode sense amplifiers for high density DRAM and PIM architectures

AU - Yo, S. M.

AU - Kim, C.

AU - Jung, S. O.

AU - Baek, K. H.

AU - Kang, S. M.

PY - 2001

Y1 - 2001

N2 - This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

AB - This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

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UR - http://www.scopus.com/inward/citedby.url?scp=0035036553&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0035036553

SN - 0272-9172

VL - 626

SP - IV938-IV941

JO - Materials Research Society Symposium Proceedings

JF - Materials Research Society Symposium Proceedings

T2 - Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications

Y2 - 24 April 2000 through 27 April 2000

ER -

New current-mode sense amplifiers for high density DRAM and PIM architectures

Abstract

ASJC Scopus subject areas

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