Abstract
This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.
| Original language | English |
|---|---|
| Pages (from-to) | IV938-IV941 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 626 |
| Publication status | Published - 2001 |
| Externally published | Yes |
| Event | Thermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications - San Francisco, CA, United States Duration: 2000 Apr 24 → 2000 Apr 27 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering