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New packaging method of field emission display using silicon-to-ITO coated glass bonding

  • Jee Won Jeong*
  • , Byeong Kwon Ju
  • , Woo Beom Choi
  • , Duck Jung Lee
  • , Yun Hi Lee
  • , Nam Yang Lee
  • , Seong Jae Jung
  • , Doo Jin Choi
  • , Myung Hwan Oh
    • *Corresponding author for this work

    Research output: Contribution to conference › Paper › peer-review

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