New plasma display panel packaging technology using electrostatic bonding method

Duck Jung Lee, Jin Wook Jeong, Young Cho Kim, Yun Hi Lee, Byeong Kwon Ju, Tae Seung Cho, Eun Ha Choi, Jin Jang

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)

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Engineering & Materials Science

Physics & Astronomy