New vacuum packaging method of field emission display

B. K. Ju; W. B. Choi; S. J. Jeong; N. Y. Lee; J. I. Han; K. I. Cho; M. H. Oh

doi:10.1117/12.293566

New vacuum packaging method of field emission display

B. K. Ju, W. B. Choi, S. J. Jeong, N. Y. Lee, J. I. Han, K. I. Cho, M. H. Oh

Research output: Contribution to journal › Conference article › peer-review

Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO ₂) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original language	English
Pages (from-to)	246-252
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3242
DOIs	https://doi.org/10.1117/12.293566
Publication status	Published - 1997
Externally published	Yes
Event	Smart Electronics and MEMS - Adelaide, SA, Australia Duration: 1997 Dec 11 → 1997 Dec 11

Keywords

Electrostatic bonding
FED packaging
Glass-to-glass bonding
Interlayer

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.293566

Cite this

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title = "New vacuum packaging method of field emission display",

abstract = "Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.",

keywords = "Electrostatic bonding, FED packaging, Glass-to-glass bonding, Interlayer",

author = "Ju, {B. K.} and Choi, {W. B.} and Jeong, {S. J.} and Lee, {N. Y.} and Han, {J. I.} and Cho, {K. I.} and Oh, {M. H.}",

year = "1997",

doi = "10.1117/12.293566",

language = "English",

volume = "3242",

pages = "246--252",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Smart Electronics and MEMS ; Conference date: 11-12-1997 Through 11-12-1997",

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TY - JOUR

T1 - New vacuum packaging method of field emission display

AU - Ju, B. K.

AU - Choi, W. B.

AU - Jeong, S. J.

AU - Lee, N. Y.

AU - Han, J. I.

AU - Cho, K. I.

AU - Oh, M. H.

PY - 1997

Y1 - 1997

N2 - Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

AB - Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

KW - Electrostatic bonding

KW - FED packaging

KW - Glass-to-glass bonding

KW - Interlayer

UR - http://www.scopus.com/inward/record.url?scp=57649128376&partnerID=8YFLogxK

U2 - 10.1117/12.293566

DO - 10.1117/12.293566

M3 - Conference article

AN - SCOPUS:57649128376

SN - 0277-786X

VL - 3242

SP - 246

EP - 252

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Smart Electronics and MEMS

Y2 - 11 December 1997 through 11 December 1997

ER -

New vacuum packaging method of field emission display

Abstract

Keywords

ASJC Scopus subject areas

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