Novel Double Acidic Texturing Process for Saw-Damage-Free Kerfless Multicrystalline Silicon Wafers

Yujin Jung, Soohyun Bae, Hae Seok Lee, Donghwan Kim, Yoon Mook Kang

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)


Since the kerfless wafer method for manufacturing multicrystalline silicon (mc-Si) wafers does not involve a sawing process, there occurs no saw damage on the surface, and the product is characterized by a flat surface morphology. These wafers cannot be effectively textured under the conditions of a conventional acidic etching solution with stability or efficiency because the surfaces are free of the surface damage caused by sawing. The texturing process developed in this article uses a conventional acidic etching solution without additives and a metal catalyst; the resulting process is a novel double acidic texturing (DAT) process capable of texturing using hydrofluoric acid (HF), HNO3, CH3COOH, and deionized water. The kerfless wafers treated with this novel texturing treatment had a weighted average reflectance (Rw) of 25.40%, which is ∼5.76% less than that of kerfless wafers textured under conventional acidic texturing conditions (Rw = ∼31.16%). A solar cell manufactured with the new DAT process showed an enhanced short-circuit current density (+2.65 mA·cm-2), fill factor (+3.87%), and efficiency (+2.18%) than those of a cell fabricated without using this novel double treatment.

Original languageEnglish
Article number9169689
Pages (from-to)1545-1551
Number of pages7
JournalIEEE Journal of Photovoltaics
Issue number6
Publication statusPublished - 2020 Nov

Bibliographical note

Funding Information:
Manuscript received May 22, 2020; revised July 6, 2020; accepted August 1, 2020. Date of publication August 17, 2020; date of current version October 21, 2020. This work was supported in part by the International Collaborative Energy Technology R&D Program, in part by the New and Renewable Energy Core Technology Program of the Korea Institute of Energy Technology Evaluation and Planning granted financial from the Ministry of Trade, Industry and Energy, Republic of Koreaunder Grant 20188550000450 and Grant 20193091010240, and in part by the KU-KIST Graduate School Project. (Corresponding author: Yoonmook Kang.) Yujin Jung, Soohyun Bae, and Donghwan Kim are with the Department of Materials Science and Engineering, Korea University, Seoul 02841, South Korea (e-mail: [email protected]; [email protected]; [email protected]).

Publisher Copyright:
© 2011-2012 IEEE.


  • Acidic etching
  • Kerfless silicon texturing
  • Kerfless wafer
  • acidic texturing
  • additive-free texturing
  • multicrystalline texturing
  • silicon texturing
  • solar cell
  • solar cell texturing
  • surface texture
  • surface treatment

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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